Topic: Interconnect materials development for advanced electronics packaging，Lead-free soldering, nanomaterials for printed electronics, and advanced power electronics packaging
Speaker: Professor  Katsuaki Suganuma，
         Institute of Scientific and Industrial Research，Osaka University, Japan
Time: 10:00-12:00,  (Tue.) Nov.03 , 2015
Venue: Room 468, Lee Hsun Building, IMR CAS
Welcome to attend!
Abstract:
Today, lead-free solders have been widely applied as the standard interconnection materials not only for consumer electronics but also for automobile and industrial machine systems used in a harsh environment. Interconnect technology plays one of the key roles on modern manufacturing. The understanding of microstructure on nano scale provides us rich information not only of interconnection nature but also of mechanical properties, of electric/thermal performance, of mechanism of interface reactions of dissimilar materials, and many other properties. 
The quality of electronics products is strongly dependent both on functions and on reliability. Suganuma has worked on variety of interconnection materials involving lead-free solders, conductive adhesives, printed electronics flexible materials, power electronics interconnects, and ceramics/metal bonded components. This lecture will make a brief review on the advanced interconnects materials development in recent years. It will be shown that the microstructural understanding with the aid of variety of analyses helps in the practical developments.