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8.15】Microelectronic Workshop on Packaging Materials and Technology
 
2013-08-02 | 文章来源:沈阳材料科学国家(联合)实验室        【 】【打印】【关闭

Time:9:00-12:00,Thurs.,15 August 2013

Venue:Room 468, Lee Hsun Building, IMR

Topic 1: Three-dimensional microfabrication technology and its application

Speaker: Dr. Yi Zhang (张毅) 

      National Institute of Advanced Industrial Science and Technology, Japan

      (日本国立产业技术综合研究所)

Topic 2: Void-free filling of via in silicon and polymer

Speaker: Dr. Qingsheng Zhu (祝清省) 

      Institute of Metal Research, Chinese Academy of Sciences

     (中国科学院金属研究所)

Tipic 3: Rapid pressureless low temperature sintering of Ag nanoparticles for high power density electronic packaging

Speaker: Dr. Mingyu Li (李明宇) 

      Harbin Institute of Technology Shenzhen Graduate School

     (哈尔滨工业大学深圳研究生院)

Tipic 4: Interfacial reaction of low-temperature lead-free solder joint

Speaker: Dr. Zhiquan Liu (刘志权) 

      Institute of Metal Research, Chinese Academy of Sciences

     (中国科学院金属研究所)

Welcome to attend!

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